1. Alloy bonding wire 2. High quality 3. Good price 4. Advanced tech manufacture 5. Certification: ISO,ROHS,MSDS,Reach Features of products: 1. excellent antioxidant capacity on surface 2. no need for protective gas during bonding 3. same hardness and wire...

1. Gold bonding wire 2. High quality 3. Good price 4. Advanced tech manufacture 5. Certification: ISO,ROHS,MSDS,Reach Features of products: 1. high purity:Au 99.99% 2.diameter:...

1. Gold bonding wire 2. High quality 3. Good price 4. Advanced tech manufacture 5. Certification: ISO,ROHS,MSDS,Reach     Gold bonding wire is a kind of material for inner lead with excellent electrical conductivity, mechanical properties, curvature, breaking...

A new type of inner lead material used for LED packaging and IC packaging in microelectronics industries. Features of products: 1. excellent antioxidant capacity on surface 2. no need for protective gas during bonding 3. same hardness and wire hardness as gold...

Alloy bonding wire is a new type of inner lead material launched by us to meet market demand. Alloy bonding wire is a new type of inner lead material launched by us to meet market demand. The surface has excellent antioxidant capacity, no need for protective gas during bonding. It...

Silver bonding wire is a new type of inner lead material launched by us to meet market demand. Silver bonding wire is a new type of inner lead material launched by us to meet market demand. It's superior feature will makes it possible to take the place of gold bonding wire in this...

A main joint material for semiconductor packaging. Features of products: 1. material costs: low 2. electronical conductivity: 5.88 10E7/Ohm 3. thermal conductivity: 39.5KW/m2k  4. mechanical properties: good 5. stability: stable 6. solder...

Silver bonding wire is a new type of inner lead material launched by us to meet market demand. Features of products: 1. lower cost 2. high mechanical property 3. fine electronical conductivity 4. high elongationDiameter (mm) : 0.0180.0200.0230.025special...

Functions primarily as a connecting material for chip and external circuit, widely used in LED packaging and IC packaging. Features of products: 1. high purity:Au 99.99% 2.diameter:...

main joint material for semiconductor packaging Copper bonding wire is a kind of material for inner lead with excellent electrical, thermal, mechanical properties and excellent chemical stability, mainly for ket materials of semiconductor packaging( molding compound, solder ball,...